CyberOptics Semiconductor

CASE STUDY: WaferSense® Vibration and Leveling Sensor Characterize Tools within Diffusion Furnace to Correct Yield Problems

2012-01-17T07:26:00.001-08:00

In an article recently published in EuroAsia Semiconductor, Allyn Jackson, Field Application Engineer at CyberOptics, discusses how the WaferSense Auto Vibration Sensor (AVS) and Auto Leveling Sensor (ALS) worked jointly to identify and quantify wafer mishandling and excessive vibrations in the various tools within a 200mm diffusion furnace. Test procedures and results are quantified in detailed graphics. By investigating the entire wafer path, the sensors identified key problem areas so corrective action could be taken. As a result, all tools now are performing at acceptable yield levels. New preventive maintenance requirements and process controls also were established for both the tools and engineers within the diffusion furnace. To read more click http://www.cyberopticssemi.com/content/files/news/documents/EUROASIA%20MAG%202011.pdf

WaferSense® Auto Leveling Sensor Keeps Equipment Straight During Wafer Fabrication

2012-01-17T07:25:00.001-08:00

Process failures and tool reconfigurations can misalign semiconductor equipment, taking a considerable toll on your productivity. Verifying and realigning equipment can take several hours, causing equipment downtime and loss of revenue. Unlike traditional wired or manual methods, CyberOptics’ WaferSense Auto Leveling System (ALS2) doesn't require equipment disassembly or disruptions to vacuum chambers, so you can reduce calibration time by 80% or more.

Shaped like a wafer, this wireless precision instrument easily captures the inclination of previously out-of-reach semiconductor process equipment. More accurate and less time-consuming than visual inspection, the WaferSense ALS2 reduces setup time and preventative maintenance downtime by promptly delivering reliable, real-time measurements.

Engineers can easily take level measurements using the ALS’ LevelView's real-time "bubble" graphic feedback. Levels can be set to any reference plane within the sensor's operating range (± 4 degrees from absolute). Users can even define Go/No Go regions and log data and notes for future reference.

Because sensors output real-time data, fab engineers don't have to rely upon eyeballing or estimation. WaferSense ALS2 data delivers consistent results to optimize their equipment's setup to limit scrap, improve uptime, and harness better yields.

Here’s how the WaferSense ALS can optimize your wafer fabrication process:

Photolithography: level and set co-planarity of load ports, robots, end effectors, spin cups, pedestals, and lift pins in coater developer track tools.

Etch: level and set co-planarity of load ports, robots and end effectors, as well as leveling the wafer electrode and lift pins.

CMP: leveling and setting co-planarity of load ports, robots, end effectors as well as platen leveling.

Diffusion: level and set co-planarity of load ports, robots and boats in vertical furnaces. ALS conveniently and accurately sets perpendicularity of tall diffusion boats

Thin Films: leveling and setting co-planarity of load ports, robots, end effectors, aligners and stockers, as well as leveling the wafer pedestals and lift pins.

Implant: level and set co-planarity of load ports, robots, end effectors and for leveling Implant Disks.

Metalization: level and set co-planarity of load ports, robots and end effectors as well as controlling the inclination of the wafer during plating tool setup.

Metrology: level and set co-planarity of load ports, robots, end effectors and inspection tool stages.

Fab Automation:level and set co-planarity of load ports, robots, end effectors, aligners, FOUP stockers, as well as FOUP transport system checks and setups.

For more information on the WaferSense ALS, visit http://www.cyberopticssemi.com/products/wafersense/als2 or contact CyberOptics at CSsupport@cyberoptics.com or 800.366.9131

Wireless Particle Counting Wafer Improves Semiconductor Tool Particle Qualification

2011-12-01T10:40:00.001-08:00

Explaining the limitations of traditional particle qualification methods, CyberOptics Semiconductor offers case studies with statistics comparing the performance of its WaferSense Airborne Particle Sensor against bench top and hand helds when performing the same task. A copy of his presentation can be downloaded at: http://www.cyberopticssemi.com/content/files/resources/Particle%20Counting%20Wafer%20Improves%20Tool%20Particle%20Qualifications%20Oct%202011%20b.pdf

CyberOptics Semiconductor to Demo Final Production Version of WaferSense® Airborne Particle Sensor

2011-11-28T04:59:00.001-08:00

CyberOptics Semiconductors (www.cyberopticssemi.com) will demonstrate the final production version of the WaferSense® Airborne Particle Sensor (APS) during Semicon Japan in booth number 5B-204. The company will also feature its full line of WaferSense wireless metrology devices at the international trade show scheduled for December 5 – 7, 2011 at the Makuhari Messe in Chiba, Japan.

Addressing the limitations of traditional airborne particle with limited reach and static output, the WaferSense APS travels through the entire semiconductor process, counting particles to identify when and where particles are occurring in real time. By reducing the time and expense associated with process equipment particle qualification, the APS improves die yield and compress final wafer inspection.

Fabs unable to isolate and mitigate the source of particles in a tool before wafer processing can use this sensor to efficiently detect and classify particles with their exact sources as wafers are transferred, slit valves actuate and chambers are cycled, pumped down and purged. With real-time views of particle conditions, process engineers can address specific trouble spots and be better prepared to pass particle qualifications on the very first attempt.

The APS is available in 200 mm, 300 mm (and 450mm special order) wafer-like form factors. For more information on the Airborne Particle Sensor, please refer to our web site at http://www.cyberopticssemi.com/products/wafersense/aps/ or contact sales at CSsales@cyberoptics.com. You can also visit the company’s Japanese language site at http://jp.cyberopticssemi.com/.

CyberOptics Semiconductor's WaferSense® Airborne Particle Sensor Is Finalist for Prism Award

2011-11-17T16:51:00.001-08:00

CyberOptics’ WaferSense® Airborne Particle Sensor is a finalist in the Prism Awards presented by SPIE and Photonics Media. The Prism Awardsis an international competition recognizing cutting-edge products that break conventional ideas and improve life through photonics. The program uniquely recognizes scientific innovation among trend-setting technological and industrial categories. The WaferSense Airborne Particle Sensor is one of three finalists in the category of Detectors, Sensing, Imaging, and Cameras.
The winner of the Prism Award will be announced at Photonics West scheduled Jan. 21 – 26 in San Francisco, CA. To view the finalists, visit: http://www.photonicsprismaward.com/finalists.aspx
What’s Innovative about the WaferSense Airborne Particle Sensor?
A new particle detection methodology for tool qualification, the WaferSense Airborne Particle Sensor (APS) enables engineers to succinctly monitor and control contaminations in their tools and protect die yield with real-time views of particle conditions to address specific areas of concern instead of the whole tool. Read more at: http://www.cyberopticssemi.com/node/127

Auto Vibration System Offers SPC Tools for Enhanced Analysis of Semiconductor Equipment Vibration Data

2011-11-12T14:41:00.001-08:00

Whenever a wafer is moved or something within the vicinity of the wafer moves, resulting vibration might be a source of wafer defects. Characterizing wafer exposure to vibration is often necessary to identify and resolve seemingly mysterious wafer defect issues. Our WaferSense® Auto Vibration System offers the monitoring tool and analysis software to both identify and quantify vibration sources and effects.
While the wireless wafer-like Auto Vibration Sensor measures vibrations of wafer transfers in x, y and z dimensions during semiconductor processes and fabrications, its companion vibration monitoring software allows engineers to quantify vibration data using statistical reporting tools. Using the WaferSense Auto Vibration System, users can create the following data time domain summary reports:
• Slippage Factor (likeliness for a wafer to slip)
• Number of peaks
• Mean amplitude
• Standard deviation of the amplitude
• Max and Min of the amplitude
• Area under the curve
To read about two scenarios where the WaferSense Auto Vibration System was used to quantify vibration sources, please go to: http://www.cyberopticssemi.com/node/124

450 mm Wireless Wafer Processing Metrology Sensors Support Next-Generation of Semiconductor Producti

2011-10-11T16:44:00.001-07:00

CyberOptics Semiconductor offers a line of wireless 450 mm wafer processing metrology sensors to help chipmakers and tool manufacturers qualify next-generation semiconductor production processes.
CyberOptics’ 450 mm carbon fiber WaferSense® sensors are designed to obtain precise metrology data to optimize new processing equipment for shrinking 32 nm and 22 nm process tolerances, according to Craig C. Ramsey, Ph.D., CyberOptics Semiconductor’s general manager.
CyberOptics’ 450 mm sensors allow engineers to level processing equipment, reduce equipment vibration and set three axis wafer-transfer coordinates. Each wafer-like device follows the processing life of a wafer and reports real-time metrology data via a GUI.
The company’s line of 450 mm metrology devices is available by special order: the Auto Teaching System (ATS450), Auto Vibration System (AVS450) and Auto Leveling System 2 Vertical (ALS2V450).
Engineers can implement CyberOptics’ WaferSense sensors to optimize equipment and tools used to perform processes across the fab: photolithography; etch; diffusion; thin film; implant; metallization; chemical mechanical planarization (CMP) and fab automation.
Detailed information on CyberOptics’ WaferSense productsis available online at http://www.cyberopticssemi.com/products or by contacting sales at (503) 495-2200 for more information.

Who is attending Semicon Taiwan?

2011-09-07T12:07:00.001-07:00

Check out an interactive demo of the WaferSense® Airborne Particle Sensor along our other WaferSense wireless metrology devices including the Auto Leveling System and Auto Vibration System, during Semicon Taiwan this week in our distributors Taiwan Puritic Corp. Booth No. 742.

CyberOptics’ WaferSense family of products offers a wireless set of measurement solutions for leveling, gapping, and teaching semiconductor equipment. Find out how our wireless measurement systems work together or alone to increase fab effectiveness and reduce overall cost of operations.

Mr. Mark Hannaford, Director of sales and Marketing of CyberOptics Semiconductor, will be in attendance to discuss your product applications and requirements. To schedule an appointment, contact Lindsey Dietz at ldietz@cyberoptics.com.

For more information on CyberOptics’ complete line of WaferSense products including the Auto Gapping System, Auto Teaching System and Auto Leveling System, please refer to: http://www.cyberopticssemi.com/products/wafersense

Reference Tracing Capability of Auto Vibration Sensor Supports Vibration Characterization as part of Routine Maintenance

2011-09-05T16:49:00.001-07:00

CyberOptics Semiconductor discusses how its WaferSense™ Auto Vibration Sensors offer a Go/No Go feature that allows users to monitor traces for excessive levels of vibration, indicating when specified levels are exceeded. Follow the discussion at: http://www.cyberopticssemi.com/node/122

Demonstrational Videos Explain How WaferSense® Wireless Sensors Measure Critical Parameters in Semiconductor Fabrication Processes and Equipment

2011-08-24T15:21:00.000-07:00

Demonstrational videos explaining how WaferSense® wireless metrology devices seamlessly measure critical parameters in semiconductor fabrication processes are available on CyberOptics Semiconductor web site at http://www.cyberopticssemi.com/node/114. Products in the WaferSense family provide leveling, gapping teaching as well as detection of vibrations and airborne particles in semiconductor process equipment. These wireless measurement systems work together or alone to increase fab effectiveness, fine tune existing equipment and reduce overall cost of operations.
Included in the WaferSense family:
• WaferSense® Auto Vibration System: Travels through wafer process areas and reports real-time acceleration data in three axes for engineers to identify vibration sources. http://www.cyberopticssemi.com/products/wafersense/avs/

• WaferSense® Airborne Particle Sensor: Monitors airborne particles in process equipment, reporting information in real-time to efficiently validate and analyze wafer contamination. http://www.cyberopticssemi.com/products/wafersense/aps/

• WaferSense® Auto Gapping: Measures gaps critical to the outcome of semiconductor processes such as thin-film deposition, sputtering and etch. http://www.cyberopticssemi.com/products/wafersense/ags/

• WaferSense® Auto Teaching System: Moves through semiconductor equipment to capture three-dimensional offset data for accurate calibration of transfer positions. Also helps find lost or broken wafers to correct portion of the tool. http://www.cyberopticssemi.com/products/wafersense/ats/

• WaferSense® Auto Leveling System 2 Vertical: Moves through semiconductor process equipment to take critical 2D level measurements. http://www.cyberopticssemi.com/products/wafersense/als2/

Check out the latest video demos on these products at: http://www.cyberopticssemi.com/node/114

WaferSense® Particle Sensor (APS) Captures Best of West Honor at Semicon West 2011

2011-08-24T15:19:00.000-07:00

A last minute entry to the Best of West 2011 Awards sponsored by Solid State Technology and SEMI to recognize important product and technology developments in the microelectronics industries proved successful as our WaferSense Airborne Particle Sensor (APS) was chosen as one of three finalists.

The latest addition to our WaferSense family of semiconductor sensors, the APS validates and analyzes wafer contamination in real time for wafer processing equipment used in the semiconductor market. It moves through semiconductor process equipment to monitor airborne particles, reporting information in real-time to allow engineers to efficiently validate wafer contamination.

Market ready just this past year, the APS is positioned to reduce and/or replace handheld and bench-top particle counters commonly used to track particles in semiconductor tools. While relatively low cost and simple to use, these methods can only monitor easily accessible areas of open tools and not operate under actual wafer conditions nor measure the entire wafer path. While effective, monitor wafers are time consuming and potentially expensive as they must be partitioned and sent to each individual chamber and/or tool location to isolate the source of the particle contamination.

Our new Airborne Particle Sensor is the first semiconductor sensor to identify particles under actual wafer conditions (under certain heat tolerances)in tool and report data in real-time to validate and analyze particle contamination.Available in 200 mm and 300 mm form factors, the APS can go deep inside a tool and communicate data unlike legacy handheld particle counters whose range is limited by hand reach and require opening the tool.

To find out more about how our APS eliminates and/or reduces ineffective and costly particle monitoring methods, read our latest feature in Tap Times on page 34 at http://flash-pub.com/pub/ebooks/8078c0f1e6/view_book.html. Or view the pdf version at http://www.cyberopticssemi.com/content/files/news/documents/Tap%20Times%20Article%202011.pdf