Tuesday, January 17, 2012
CASE STUDY: WaferSense® Vibration and Leveling Sensor Characterize Tools within Diffusion Furnace to Correct Yield Problems
In an article recently published in EuroAsia Semiconductor, Allyn Jackson, Field Application Engineer at CyberOptics, discusses how the WaferSense Auto Vibration Sensor (AVS) and Auto Leveling Sensor (ALS) worked jointly to identify and quantify wafer mishandling and excessive vibrations in the various tools within a 200mm diffusion furnace. Test procedures and results are quantified in detailed graphics. By investigating the entire wafer path, the sensors identified key problem areas so corrective action could be taken. As a result, all tools now are performing at acceptable yield levels. New preventive maintenance requirements and process controls also were established for both the tools and engineers within the diffusion furnace. To read more click http://www.cyberopticssemi.com/content/files/news/documents/EUROASIA%20MAG%202011.pdf
WaferSense® Auto Leveling Sensor Keeps Equipment Straight During Wafer Fabrication
Process failures and tool reconfigurations can misalign semiconductor equipment, taking a considerable toll on your productivity. Verifying and realigning equipment can take several hours, causing equipment downtime and loss of revenue. Unlike traditional wired or manual methods, CyberOptics’ WaferSense Auto Leveling System (ALS2) doesn't require equipment disassembly or disruptions to vacuum chambers, so you can reduce calibration time by 80% or more.
Shaped like a wafer, this wireless precision instrument easily captures the inclination of previously out-of-reach semiconductor process equipment. More accurate and less time-consuming than visual inspection, the WaferSense ALS2 reduces setup time and preventative maintenance downtime by promptly delivering reliable, real-time measurements.
Engineers can easily take level measurements using the ALS’ LevelView's real-time "bubble" graphic feedback. Levels can be set to any reference plane within the sensor's operating range (± 4 degrees from absolute). Users can even define Go/No Go regions and log data and notes for future reference.
Because sensors output real-time data, fab engineers don't have to rely upon eyeballing or estimation. WaferSense ALS2 data delivers consistent results to optimize their equipment's setup to limit scrap, improve uptime, and harness better yields.
Here’s how the WaferSense ALS can optimize your wafer fabrication process:
Photolithography: level and set co-planarity of load ports, robots, end effectors, spin cups, pedestals, and lift pins in coater developer track tools.
Etch: level and set co-planarity of load ports, robots and end effectors, as well as leveling the wafer electrode and lift pins.
CMP: leveling and setting co-planarity of load ports, robots, end effectors as well as platen leveling.
Diffusion: level and set co-planarity of load ports, robots and boats in vertical furnaces. ALS conveniently and accurately sets perpendicularity of tall diffusion boats
Thin Films: leveling and setting co-planarity of load ports, robots, end effectors, aligners and stockers, as well as leveling the wafer pedestals and lift pins.
Implant: level and set co-planarity of load ports, robots, end effectors and for leveling Implant Disks.
Metalization: level and set co-planarity of load ports, robots and end effectors as well as controlling the inclination of the wafer during plating tool setup.
Metrology: level and set co-planarity of load ports, robots, end effectors and inspection tool stages.
Fab Automation:level and set co-planarity of load ports, robots, end effectors, aligners, FOUP stockers, as well as FOUP transport system checks and setups.
For more information on the WaferSense ALS, visit http://www.cyberopticssemi.com/products/wafersense/als2 or contact CyberOptics at CSsupport@cyberoptics.com or 800.366.9131
Shaped like a wafer, this wireless precision instrument easily captures the inclination of previously out-of-reach semiconductor process equipment. More accurate and less time-consuming than visual inspection, the WaferSense ALS2 reduces setup time and preventative maintenance downtime by promptly delivering reliable, real-time measurements.
Engineers can easily take level measurements using the ALS’ LevelView's real-time "bubble" graphic feedback. Levels can be set to any reference plane within the sensor's operating range (± 4 degrees from absolute). Users can even define Go/No Go regions and log data and notes for future reference.
Because sensors output real-time data, fab engineers don't have to rely upon eyeballing or estimation. WaferSense ALS2 data delivers consistent results to optimize their equipment's setup to limit scrap, improve uptime, and harness better yields.
Here’s how the WaferSense ALS can optimize your wafer fabrication process:
Photolithography: level and set co-planarity of load ports, robots, end effectors, spin cups, pedestals, and lift pins in coater developer track tools.
Etch: level and set co-planarity of load ports, robots and end effectors, as well as leveling the wafer electrode and lift pins.
CMP: leveling and setting co-planarity of load ports, robots, end effectors as well as platen leveling.
Diffusion: level and set co-planarity of load ports, robots and boats in vertical furnaces. ALS conveniently and accurately sets perpendicularity of tall diffusion boats
Thin Films: leveling and setting co-planarity of load ports, robots, end effectors, aligners and stockers, as well as leveling the wafer pedestals and lift pins.
Implant: level and set co-planarity of load ports, robots, end effectors and for leveling Implant Disks.
Metalization: level and set co-planarity of load ports, robots and end effectors as well as controlling the inclination of the wafer during plating tool setup.
Metrology: level and set co-planarity of load ports, robots, end effectors and inspection tool stages.
Fab Automation:level and set co-planarity of load ports, robots, end effectors, aligners, FOUP stockers, as well as FOUP transport system checks and setups.
For more information on the WaferSense ALS, visit http://www.cyberopticssemi.com/products/wafersense/als2 or contact CyberOptics at CSsupport@cyberoptics.com or 800.366.9131
Thursday, December 1, 2011
Wireless Particle Counting Wafer Improves Semiconductor Tool Particle Qualification
Explaining the limitations of traditional particle qualification methods, CyberOptics Semiconductor offers case studies with statistics comparing the performance of its WaferSense Airborne Particle Sensor against bench top and hand helds when performing the same task. A copy of his presentation can be downloaded at: http://www.cyberopticssemi.com/content/files/resources/Particle%20Counting%20Wafer%20Improves%20Tool%20Particle%20Qualifications%20Oct%202011%20b.pdf
Monday, November 28, 2011
CyberOptics Semiconductor to Demo Final Production Version of WaferSense® Airborne Particle Sensor
CyberOptics Semiconductors (www.cyberopticssemi.com) will demonstrate the final production version of the WaferSense® Airborne Particle Sensor (APS) during Semicon Japan in booth number 5B-204. The company will also feature its full line of WaferSense wireless metrology devices at the international trade show scheduled for December 5 – 7, 2011 at the Makuhari Messe in Chiba, Japan.
Addressing the limitations of traditional airborne particle with limited reach and static output, the WaferSense APS travels through the entire semiconductor process, counting particles to identify when and where particles are occurring in real time. By reducing the time and expense associated with process equipment particle qualification, the APS improves die yield and compress final wafer inspection.
Fabs unable to isolate and mitigate the source of particles in a tool before wafer processing can use this sensor to efficiently detect and classify particles with their exact sources as wafers are transferred, slit valves actuate and chambers are cycled, pumped down and purged. With real-time views of particle conditions, process engineers can address specific trouble spots and be better prepared to pass particle qualifications on the very first attempt.
The APS is available in 200 mm, 300 mm (and 450mm special order) wafer-like form factors. For more information on the Airborne Particle Sensor, please refer to our web site at http://www.cyberopticssemi.com/products/wafersense/aps/ or contact sales at CSsales@cyberoptics.com. You can also visit the company’s Japanese language site at http://jp.cyberopticssemi.com/.
Addressing the limitations of traditional airborne particle with limited reach and static output, the WaferSense APS travels through the entire semiconductor process, counting particles to identify when and where particles are occurring in real time. By reducing the time and expense associated with process equipment particle qualification, the APS improves die yield and compress final wafer inspection.
Fabs unable to isolate and mitigate the source of particles in a tool before wafer processing can use this sensor to efficiently detect and classify particles with their exact sources as wafers are transferred, slit valves actuate and chambers are cycled, pumped down and purged. With real-time views of particle conditions, process engineers can address specific trouble spots and be better prepared to pass particle qualifications on the very first attempt.
The APS is available in 200 mm, 300 mm (and 450mm special order) wafer-like form factors. For more information on the Airborne Particle Sensor, please refer to our web site at http://www.cyberopticssemi.com/products/wafersense/aps/ or contact sales at CSsales@cyberoptics.com. You can also visit the company’s Japanese language site at http://jp.cyberopticssemi.com/.
Thursday, November 17, 2011
CyberOptics Semiconductor's WaferSense® Airborne Particle Sensor Is Finalist for Prism Award
CyberOptics’ WaferSense® Airborne Particle Sensor is a finalist in the Prism Awards presented by SPIE and Photonics Media. The Prism Awardsis an international competition recognizing cutting-edge products that break conventional ideas and improve life through photonics. The program uniquely recognizes scientific innovation among trend-setting technological and industrial categories. The WaferSense Airborne Particle Sensor is one of three finalists in the category of Detectors, Sensing, Imaging, and Cameras.
The winner of the Prism Award will be announced at Photonics West scheduled Jan. 21 – 26 in San Francisco, CA. To view the finalists, visit: http://www.photonicsprismaward.com/finalists.aspx
What’s Innovative about the WaferSense Airborne Particle Sensor?
A new particle detection methodology for tool qualification, the WaferSense Airborne Particle Sensor (APS) enables engineers to succinctly monitor and control contaminations in their tools and protect die yield with real-time views of particle conditions to address specific areas of concern instead of the whole tool. Read more at: http://www.cyberopticssemi.com/node/127
The winner of the Prism Award will be announced at Photonics West scheduled Jan. 21 – 26 in San Francisco, CA. To view the finalists, visit: http://www.photonicsprismaward.com/finalists.aspx
What’s Innovative about the WaferSense Airborne Particle Sensor?
A new particle detection methodology for tool qualification, the WaferSense Airborne Particle Sensor (APS) enables engineers to succinctly monitor and control contaminations in their tools and protect die yield with real-time views of particle conditions to address specific areas of concern instead of the whole tool. Read more at: http://www.cyberopticssemi.com/node/127
Saturday, November 12, 2011
Auto Vibration System Offers SPC Tools for Enhanced Analysis of Semiconductor Equipment Vibration Data
Whenever a wafer is moved or something within the vicinity of the wafer moves, resulting vibration might be a source of wafer defects. Characterizing wafer exposure to vibration is often necessary to identify and resolve seemingly mysterious wafer defect issues. Our WaferSense® Auto Vibration System offers the monitoring tool and analysis software to both identify and quantify vibration sources and effects.
While the wireless wafer-like Auto Vibration Sensor measures vibrations of wafer transfers in x, y and z dimensions during semiconductor processes and fabrications, its companion vibration monitoring software allows engineers to quantify vibration data using statistical reporting tools. Using the WaferSense Auto Vibration System, users can create the following data time domain summary reports:
• Slippage Factor (likeliness for a wafer to slip)
• Number of peaks
• Mean amplitude
• Standard deviation of the amplitude
• Max and Min of the amplitude
• Area under the curve
To read about two scenarios where the WaferSense Auto Vibration System was used to quantify vibration sources, please go to: http://www.cyberopticssemi.com/node/124
While the wireless wafer-like Auto Vibration Sensor measures vibrations of wafer transfers in x, y and z dimensions during semiconductor processes and fabrications, its companion vibration monitoring software allows engineers to quantify vibration data using statistical reporting tools. Using the WaferSense Auto Vibration System, users can create the following data time domain summary reports:
• Slippage Factor (likeliness for a wafer to slip)
• Number of peaks
• Mean amplitude
• Standard deviation of the amplitude
• Max and Min of the amplitude
• Area under the curve
To read about two scenarios where the WaferSense Auto Vibration System was used to quantify vibration sources, please go to: http://www.cyberopticssemi.com/node/124
Tuesday, October 11, 2011
450 mm Wireless Wafer Processing Metrology Sensors Support Next-Generation of Semiconductor Producti
CyberOptics Semiconductor offers a line of wireless 450 mm wafer processing metrology sensors to help chipmakers and tool manufacturers qualify next-generation semiconductor production processes.
CyberOptics’ 450 mm carbon fiber WaferSense® sensors are designed to obtain precise metrology data to optimize new processing equipment for shrinking 32 nm and 22 nm process tolerances, according to Craig C. Ramsey, Ph.D., CyberOptics Semiconductor’s general manager.
CyberOptics’ 450 mm sensors allow engineers to level processing equipment, reduce equipment vibration and set three axis wafer-transfer coordinates. Each wafer-like device follows the processing life of a wafer and reports real-time metrology data via a GUI.
The company’s line of 450 mm metrology devices is available by special order: the Auto Teaching System (ATS450), Auto Vibration System (AVS450) and Auto Leveling System 2 Vertical (ALS2V450).
Engineers can implement CyberOptics’ WaferSense sensors to optimize equipment and tools used to perform processes across the fab: photolithography; etch; diffusion; thin film; implant; metallization; chemical mechanical planarization (CMP) and fab automation.
Detailed information on CyberOptics’ WaferSense productsis available online at http://www.cyberopticssemi.com/products or by contacting sales at (503) 495-2200 for more information.
CyberOptics’ 450 mm carbon fiber WaferSense® sensors are designed to obtain precise metrology data to optimize new processing equipment for shrinking 32 nm and 22 nm process tolerances, according to Craig C. Ramsey, Ph.D., CyberOptics Semiconductor’s general manager.
CyberOptics’ 450 mm sensors allow engineers to level processing equipment, reduce equipment vibration and set three axis wafer-transfer coordinates. Each wafer-like device follows the processing life of a wafer and reports real-time metrology data via a GUI.
The company’s line of 450 mm metrology devices is available by special order: the Auto Teaching System (ATS450), Auto Vibration System (AVS450) and Auto Leveling System 2 Vertical (ALS2V450).
Engineers can implement CyberOptics’ WaferSense sensors to optimize equipment and tools used to perform processes across the fab: photolithography; etch; diffusion; thin film; implant; metallization; chemical mechanical planarization (CMP) and fab automation.
Detailed information on CyberOptics’ WaferSense productsis available online at http://www.cyberopticssemi.com/products or by contacting sales at (503) 495-2200 for more information.
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